Dr. Chong Leong, Gan received the B.S. Degree in Chemical Engineering from National University of Malaysia in 2000, M.S. degree in Chemical Instrumentation in 2003 from University Science Malaysia, and Ph.D. in Nanoelectronic Engineering from University Malaysia Perlis, Malaysia in 2015. He has worked as a Product Quality Engineer and Process Engineer for semiconductor packaging and wafer fabrication plant since 2000. Since 2006, he has been a Quality and Reliability Member of Technical Staff with Altera Corporation (M) Sdn Bhd, Product Engineering Manager with Osram Opto-Semiconductors, FA & Reliability Manager with SanDisk Storage Malaysia. CL is now working as Senior Memory Reliability Manager with Western Digital Inc. He has authored more than 40 peer reviewed papers in journals and conference proceedings on various aspects of LED optoelectronics reliability, microelectronic packaging and reliability engineering. His current research interests include advanced packaging technologies, electronic materials characterization, copper ball bond reliability, microelectronics reliability and nanomaterial engineering. He is SMIEEE, FIET and RACI CChem and also serving as journal reviewer of various international referred journals such as Journal of Materials Science: Materials in Electronics, Physica Solidii Status (B), IEEE Transactions on Reliability, IEEE CPMT journal, IEEE ACCESS, PlosOne, Journal of Materials Science, ASME Journal of Electronics Packaging, Microelectronics Reliability, Journal of Materials Science: Materials in Electronics, Gold Bulletin, Nano Letters and Microelectronics International starting 2012. His H-index is 12 and editorial member of Emerald’s Soldering and Surface Mount Technology, Microelectronics International, Circuits World and IJQRM Journal since 2013.