Biography
Prof. Qing Duan Meng
Prof. Qing Duan Meng
Henan University of Science and technology, China
Title: Structural reliability of the InSb infrared focal plane array detector subjected to liquid nitrogen shocking tests
Abstract: 
The typical failure patterns, such as, the local fracture of the InSb chip, the local delamination of the InSb chip, and the local disconnecting of the indium bump array appearing in the InSb infrared focal plane arrays (IRFPAs) detector in liquid nitrogen shocking tests, limit its batch production capacity. Focusing on these problems, we employ theoretical calculation, modeling and simulation, and experimental verification to search the effective approach to solve these problems. Firstly, employing the calculation theory suitable to calculate the thermal stress in the elastic multilayer system, the structural modeling of InSb IRFPAs created with ANSYS and the typical failure distribution characteristics in the InSb IRFPAs, such as the local delamination region and its covering range, the origin of the fracture, the distribution of the cracks, its propagation direction, and its termination location, etc. we will ascertain the local failure mechanism of the InSb IRFPAs in liquid nitrogen shocking tests. Secondly, we assess the effects from the balanced composite structure (BCS) in the InSb IRFPAs assembly, and obtain the suitable structural parameter ranges to eliminate the thermal mismatch stress. these results will significantly improve the mass production capacity of the InSb IRFPAs.
Biography: 
Qing-Duan Meng. He received the Ph.D. degree in condensed matter physics from Institute of Physics, Chinese Academy of Sciences (CAS), in 2006. His research interests are the design and fabrication of high temperature superconductor (HTS) filters, tunable ferroelectric devices, infrared (IR) focal plane arrays detector. He is currently a Professor in the College of Electrical Engineering, Henan University of Science and Technology. In recent years, he majors in the modeling, simulation and reliability assess of the InSb IRFPAs assembly.