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Template for Manuscripts

Important Dates

Conference:

Aug. 20-22, 2019

Full Paper Due: Jul. 15, 2019

Abstract Due: Jul. 15, 2019

Audience Registration Due:
Aug. 20, 2019

Call For Papers
If you need the PDF flyer of CFP, please click here to download it.

The 6th Int'l Conference on Condensed Matter and Materials Physics (CMMP 2019) will be held in Xi'an, China during August 20 to 22, 2019. You are invited to submit papers and participate in our academic exchange. 


The conference is soliciting state-of-the-art research papers in the following areas of interest:

Brittle fracture
Computational physics of material
Computer Simulation in Soft Matter
Crystal Physics
Deformation experiments
Dielectrics
Electronic Structure & Phonons
Energy Materials
Functional Phase Transition Physics
Graphene and carbon physics
Hardening mechanisms
Intermetallic Alloys and their Surfaces: Structure, Properties and Applications
Liquid Crystals
Liquids and Complex Fluids
Liquids, Glasses & Amorphous Systems
Local Structures of Functional Materials
Low temperature physics
Magnetism and spintronics
Materials for energy
Materials physics
Matter under Extreme Conditions
Metamaterials
Metamaterials, photonics and plasmonic
Microscopic processes of plastic deformation
Nanomagnetism
Nano-materials
Nanoscale physics and technology
Nanoscale Physics at Low Temperatures
Neutron Spectroscopy
Nonlinear Dynamics Complexity and Synchronization
Novel Materials
Phase Transitions
Polymer Physics
Quantum Fluids and Solids
Quantum Gases
Quantum Interfaces
Semiconductor physics and devices
Soft condensed matter and biophysics
Solid State Physics
Statistical physics
Strongly correlated systems
Structural Studies of Nanomaterial
Structure physics
Surfaces, Interfaces and Thin Films
Theory of condensed matter